Semiconductor chips are made through a series of nanofabrication techniques done on the surface of exceedingly pure single crystal silicon substrates. These substrates are commonly referred to as wafers. Wafers that are commonly utilized include 300 mm wafers, which provide the enhanced miniaturization required for cutting-edge devices, and 200 mm wafers, which are better suited to the mixed, small batch production required for Internet of Things devices (IoT). 1. Cleanup The silicon wafers that serve as the semiconductor's foundation are cleaned. Defects in the circuit might result from even the smallest amount of wafer contamination. In order to eliminate all contaminants, including ultra-fine particles, minuscule amounts of organic or metallic residues produced during manufacture, and undesired natural oxide layers produced as a result of contact to air, chemical agents are used. 2. The Deposit of Film On the wafer, thin film layers of metals like as silicon oxide, aluminum, and